A package substrate includes: a dielectric layer having two opposite surfaces; a wiring layer embedded in the dielectric layer and exposed from the two opposite surfaces of the dielectric layer, wherein the wiring layer has solder pads, conductive pads and circuit wires electrically connecting the solder pads and the conductive pads; and a first insulating protection layer disposed on one of the two opposite surfaces of the dielectric layer to cover the dielectric layer and the wiring layer and having a plurality of openings for exposing the conductive pads, respectively. The package substrate, by directly using the dielectric layer as a base, provides a package substrate having reduced thickness and lower fabrication costs compared to the prior art.