Invention Grant
- Patent Title: Integrated circuit packaging system with package-on-package and method of manufacture thereof
- Patent Title (中): 具有封装封装的集成电路封装系统及其制造方法
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Application No.: US12542097Application Date: 2009-08-17
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Publication No.: US09230898B2Publication Date: 2016-01-05
- Inventor: HanGil Shin , DeokKyung Yang , Jong-Woo Ha
- Applicant: HanGil Shin , DeokKyung Yang , Jong-Woo Ha
- Applicant Address: SG Singapore
- Assignee: STATS ChipPAC Ltd.
- Current Assignee: STATS ChipPAC Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40 ; H01L23/498 ; H01L25/10 ; H01L25/00 ; H01L23/31 ; H01L25/065 ; H01L23/00
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a component over a side of the substrate; forming an interface module having a module via in any location for connectivity to the substrate; and mounting the entirety of the interface module over a portion of the side of the substrate next to the component.
Public/Granted literature
- US20110037157A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2011-02-17
Information query
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