Invention Grant
- Patent Title: Surface treatment in electroless process for adhesion enhancement
- Patent Title (中): 化学镀处理中的表面处理增强粘合力
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Application No.: US13897290Application Date: 2013-05-17
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Publication No.: US09230934B2Publication Date: 2016-01-05
- Inventor: Jing-Cheng Lin , Cheng-Lin Huang Huang , Wei-An Tsao
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L23/29 ; H01L25/065
Abstract:
An embodiment method of forming and a bump structure are disclosed. The bump structure includes a passivation layer formed over a metal pad, the passivation layer having a recess exposing a portion of the metal pad, and a metal bump formed over the metal pad, the metal bump having a lip extending beneath the passivation layer, the lip anchoring the metal bump to the passivation layer.
Public/Granted literature
- US20140264841A1 Surface Treatment in Electroless Process for Adhesion Enhancement Public/Granted day:2014-09-18
Information query
IPC分类:
