Invention Grant
US09230942B2 Semiconductor device including alternating stepped semiconductor die stacks
有权
半导体器件包括交替的阶梯式半导体管芯堆叠
- Patent Title: Semiconductor device including alternating stepped semiconductor die stacks
- Patent Title (中): 半导体器件包括交替的阶梯式半导体管芯堆叠
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Application No.: US14422179Application Date: 2013-02-26
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Publication No.: US09230942B2Publication Date: 2016-01-05
- Inventor: Shiv Kumar , Chin-Tien Chiu , Dacheng Huang , Zhong Lu , Zhongli Ji
- Applicant: SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Applicant Address: CN Shanghai
- Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee: SanDisk Information Technology (Shanghai) Co., Ltd.
- Current Assignee Address: CN Shanghai
- Agency: Vierra Magen Marcus LLP
- International Application: PCT/CN2013/071881 WO 20130226
- International Announcement: WO2014/131152 WO 20140904
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/00 ; H01L25/065 ; H01L23/31 ; H01L25/00 ; H01L23/00 ; H01L23/498
Abstract:
A semiconductor device including alternating stepped semiconductor die stacks to allow for large numbers of semiconductor die to be provided within a semiconductor device using short wire bonds.
Public/Granted literature
- US20150228621A1 SEMICONDUCTOR DEVICE INCLUDING ALTERNATING STEPPED SEMICONDUCTOR DIE STACKS Public/Granted day:2015-08-13
Information query
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