Invention Grant
- Patent Title: Method for producing an electronic device by assembling semi-conducting blocks and corresponding device
- Patent Title (中): 通过组装半导体块和相应的装置制造电子装置的方法
-
Application No.: US13859418Application Date: 2013-04-09
-
Publication No.: US09230950B2Publication Date: 2016-01-05
- Inventor: Philippe Galy , Jean Jimenez
- Applicant: STMICROELECTRONICS SA
- Applicant Address: FR Montrouge
- Assignee: STMICROELECTRONICS SA
- Current Assignee: STMICROELECTRONICS SA
- Current Assignee Address: FR Montrouge
- Agency: Allen, Dyer, Doppelt, Milbrath & Gilchrist, P.A.
- Priority: FR1253249 20120410
- Main IPC: H01L27/02
- IPC: H01L27/02 ; H01L21/77 ; H01L27/12 ; H01L21/762 ; H01L27/088 ; H01L29/78 ; H01L29/06 ; H01L29/43
Abstract:
At least three electrically conducting blocks are disposed within an isolating region; and at least two of them are mutually separated and capacitively coupled by a part of the isolating region. At least two of them, being semiconductor, have opposite types of conductivity or identical types of conductivity, but with different concentrations of dopants, and these are in mutual contact by one of their sides. The mutual arrangement of these blocks within the isolating region, their type of conductivity and their concentration of dopants form at least one electronic module. Some of the blocks define input and output blocks.
Public/Granted literature
- US20130264677A1 METHOD FOR PRODUCING AN ELECTRONIC DEVICE BY ASSEMBLING SEMI-CONDUCTING BLOCKS AND CORRESPONDING DEVICE Public/Granted day:2013-10-10
Information query
IPC分类:
