Invention Grant
- Patent Title: FinFETs having dielectric punch-through stoppers
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Application No.: US13314942Application Date: 2011-12-08
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Publication No.: US09230959B2Publication Date: 2016-01-05
- Inventor: Cheng-Hung Chang , Chen-Hua Yu , Chen-Nan Yeh
- Applicant: Cheng-Hung Chang , Chen-Hua Yu , Chen-Nan Yeh
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Slater & Matsil, L.L.P.
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L27/088 ; H01L21/8234 ; H01L27/12 ; H01L29/78

Abstract:
A semiconductor structure includes a semiconductor substrate; a planar transistor on a first portion of the semiconductor substrate, wherein the first portion of the semiconductor substrate has a first top surface; and a multiple-gate transistor on a second portion of the semiconductor substrate. The second portion of the semiconductor substrate is recessed from the first top surface to form a fin of the multiple-gate transistor. The fin is electrically isolated from the semiconductor substrate by an insulator.
Public/Granted literature
- US20120083107A1 FinFETs Having Dielectric Punch-Through Stoppers Public/Granted day:2012-04-05
Information query
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