Invention Grant
- Patent Title: Method of manufacturing a solid-state image pickup apparatus improved spectral balance
- Patent Title (中): 制造固态摄像装置的方法改进了光谱平衡
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Application No.: US13914953Application Date: 2013-06-11
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Publication No.: US09231016B2Publication Date: 2016-01-05
- Inventor: Hiroshi Horikoshi , Koji Kikuchi , Tomohiro Yamazaki
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JPP2009-058985 20090312
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/146

Abstract:
A solid-state image pickup apparatus includes a substrate, a wiring layer, and a waveguide. The substrate is provided with a pixel array portion constituted of a plurality of pixels each having a photoelectric converter that converts incident light into an electrical signal. The wiring layer includes a plurality of wirings and an insulating layer that covers the plurality of wirings that are laminated above the substrate. The waveguide guides light to each of the photoelectric converters of the plurality of pixels, the waveguide being formed in the wiring layer. The waveguide is formed to have a waveguide exit end from which light exits the waveguide so that a distance between the waveguide exit end and a surface of the photoelectric converter that receives light from the waveguide become shorter, as wavelengths of light guided by the waveguide are longer.
Public/Granted literature
- US20130309802A1 SOLID-STATE IMAGE PICKUP APPARATUS, METHOD OF MANUFACTURING THE SAME, AND IMAGE PICKUP APPARATUS Public/Granted day:2013-11-21
Information query
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