A screen printing method of LED module with phosphor includes: board preparation providing an LED module board with a substrate and a plurality of LED sources fixed on the substrate. The LED sources are flip chip structural and the metal electrodes thereof are fixed to the bonding pads of the substrate. A screen board is provided with meshes corresponding to the shiny sides of the LED sources of the substrate one by one. A projection of each mesh to the shiny side of the corresponding LED source has similar shape with the shiny side of the LED source. The top of the screen board is printed with allocated colloidal phosphor until each mesh is coated fully. The printed substrates are baked to solidify the phosphor. The periphery of the shiny side is fully coated.