Invention Grant
US09231180B2 Nanostructured silicide composites for thermoelectric applications
有权
用于热电应用的纳米结构化硅化物复合材料
- Patent Title: Nanostructured silicide composites for thermoelectric applications
- Patent Title (中): 用于热电应用的纳米结构化硅化物复合材料
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Application No.: US14050184Application Date: 2013-10-09
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Publication No.: US09231180B2Publication Date: 2016-01-05
- Inventor: Jean-Pierre Fleurial , Sabah K. Bux
- Applicant: California Institute of Technology
- Applicant Address: US CA Pasadena
- Assignee: California Institute of Technology
- Current Assignee: California Institute of Technology
- Current Assignee Address: US CA Pasadena
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H01L35/14
- IPC: H01L35/14 ; H01L35/22 ; H01L35/34 ; C01B33/06 ; H01L35/26
Abstract:
The present invention provides a method of preparing a nanocomposite thermoelectric material. The method includes heating a reaction mixture of a semiconductor material and a metal complex to a temperature greater than the decomposition temperature of the metal complex. The heating forms metallic inclusions having a size less than about 100 nm that are substantially evenly distributed throughout the semiconductor material forming the nanocomposite thermoelectric material. The present invention also provides a nanocomposite thermoelectric material prepared by this method.
Public/Granted literature
- US20140097391A1 NANOSTRUCTURED SILICIDE COMPOSITES FOR THERMOELECTRIC APPLICATIONS Public/Granted day:2014-04-10
Information query
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