Invention Grant
US09231183B2 Resonator element, resonator, electronic device and electronic apparatus
有权
谐振器元件，谐振器，电子设备和电子设备
- Patent Title: Resonator element, resonator, electronic device and electronic apparatus
- Patent Title (中): 谐振器元件，谐振器，电子设备和电子设备
-
Application No.: US13845646Application Date: 2013-03-18
-
Publication No.: US09231183B2Publication Date: 2016-01-05
- Inventor: Matsutaro Naito , Hideo Endo
- Applicant: Seiko Epson Corporation
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2012-062118 20120319
- Main IPC: H03H9/02
- IPC: H03H9/02 ; H03H9/19 ; H01L41/053 ; H03H9/17
Abstract:
When a length along a vibrating direction of the thickness shear vibration of a multi-stage type mesa substrate of A resonator element is x, a thickness of the vibration section is t, and a distance between the vibration section and the bonding region is y, y is in a range of −0.0151×(x/t)+0.3471≦y≦−0.0121×(x/t)+0.3471.
Public/Granted literature
- US20130241359A1 RESONATOR ELEMENT, RESONATOR, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS Public/Granted day:2013-09-19
Information query
