Invention Grant
US09231286B2 Package substrate with band stop filter and semiconductor package including the same
有权
具有带阻滤波器的封装衬底和包括其的半导体封装
- Patent Title: Package substrate with band stop filter and semiconductor package including the same
- Patent Title (中): 具有带阻滤波器的封装衬底和包括其的半导体封装
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Application No.: US13901297Application Date: 2013-05-23
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Publication No.: US09231286B2Publication Date: 2016-01-05
- Inventor: Byung Jun Bang , Sang Joon Lim , Ju Il Eom , Bok Kyu Choi , Jin Hwan Song
- Applicant: SK hynix Inc.
- Applicant Address: KR Gyeonggi-do
- Assignee: SK Hynix Inc.
- Current Assignee: SK Hynix Inc.
- Current Assignee Address: KR Gyeonggi-do
- Agency: William Park & Associates Ltd.
- Priority: KR10-2012-0151670 20121224
- Main IPC: H01P1/203
- IPC: H01P1/203 ; H05K1/02 ; H05K1/16
Abstract:
According to one embodiment, a semiconductor package includes a band stop filter, which includes: a transmission line pattern arranged on a package substrate; and a conductive stub pattern arranged along the transmission line pattern in a state of being separated from the transmission line pattern.
Public/Granted literature
- US20140176262A1 PACKAGE SUBSTRATE WITH BAND STOP FILTER AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2014-06-26
Information query
