Invention Grant
- Patent Title: Wireless IC device
- Patent Title (中): 无线IC设备
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Application No.: US13080781Application Date: 2011-04-06
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Publication No.: US09231305B2Publication Date: 2016-01-05
- Inventor: Noboru Kato
- Applicant: Noboru Kato
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2008-274771 20081024
- Main IPC: H01Q1/50
- IPC: H01Q1/50 ; H01Q7/06 ; H01Q1/22

Abstract:
A wireless IC device has a resonant frequency that is hardly altered or affected by external influences and reliably communicates with a reader/writer. The wireless IC device includes a wireless IC chip arranged to process a radio signal, a feeder circuit board coupled to the wireless IC chip and including a feeder circuit, and a radiation electrode arranged at least one principal surface of the feeder circuit board. The feeder circuit board includes a magnetic material and has the feeder circuit disposed therein. The radiation electrode is disposed on at least one principal surface of the feeder circuit board so as to be electromagnetically coupled to the feeder circuit and includes at least two open ends. The wireless IC chip is coupled to the radiation electrode through the feeder circuit and communicates with a reader/writer using HF band frequency.
Public/Granted literature
- US20110181486A1 WIRELESS IC DEVICE Public/Granted day:2011-07-28
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