Invention Grant
- Patent Title: Integrated package insertion and loading mechanism (iPILM)
- Patent Title (中): 集成封装插入和加载机制(iPILM)
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Application No.: US13995927Application Date: 2012-03-30
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Publication No.: US09231318B2Publication Date: 2016-01-05
- Inventor: Tao Liu , Tejinder Pal S. Aulakh
- Applicant: Tao Liu , Tejinder Pal S. Aulakh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Blakely, Sokoloff, Taylor & Zafman LLP
- International Application: PCT/US2012/031669 WO 20120330
- International Announcement: WO2013/147884 WO 20131003
- Main IPC: H01R13/62
- IPC: H01R13/62 ; H01R4/50 ; H01L23/32 ; H05K7/10 ; H01R43/20

Abstract:
A holding member and system including a first holding member and a second holding member, wherein each of the first holding member and the second holding member are coupled to opposite sides of a load plate of a socket. A holding member includes a body including a pair of arms extending from a first side of the body and spaced to accommodate a portion of an integrated circuit chip package therebetween and at least one clip extending from a second side opposite the first side. Also, a method including coupling an integrated circuit chip package to a first holding member and a second holding member, wherein the first holding member is coupled to a first side of a load plate of a socket and the second holding member is coupled to a second side of the load plate; and inserting the package into a socket of a printed circuit board.
Public/Granted literature
- US20140199873A1 INTEGRATED PACKAGE INSERTION AND LOADING MECHANISM (iPILM) Public/Granted day:2014-07-17
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