Invention Grant
- Patent Title: Built-up plug
- Patent Title (中): 内置插头
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Application No.: US14185040Application Date: 2014-02-20
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Publication No.: US09231332B2Publication Date: 2016-01-05
- Inventor: Hua Chai
- Applicant: AMBIT MICROSYSTEMS (SHANGHAI) LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shanghai TW New Taipei
- Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: AMBIT MICROSYSTEMS (SHANGHAI) LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shanghai TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201410007807 20140108
- Main IPC: H01R13/502
- IPC: H01R13/502 ; H01R13/514 ; H01R103/00 ; H01R105/00 ; H01R24/28
Abstract:
A built-up plug includes a first portion and a second portion. The first portion includes a first shell, a first metal foot and at least one fixing mass on the first shell. The second portion includes a second shell, a second metal foot and at least one fixing groove on the second shell. The first metal foot protrudes from a top portion of the first shell. The second metal foot protrudes from a top portion of the second shell. The fixing mass is placed in the fixing groove to combine the first portion and the second portion.
Public/Granted literature
- US20150194759A1 BUILT-UP PLUG Public/Granted day:2015-07-09
Information query
