Invention Grant
- Patent Title: Multi-beam semiconductor laser device
- Patent Title (中): 多光束半导体激光器件
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Application No.: US14466039Application Date: 2014-08-22
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Publication No.: US09231374B2Publication Date: 2016-01-05
- Inventor: Yutaka Inoue , Hideki Hara , Shuichi Usuda
- Applicant: Oclaro Japan, Inc.
- Applicant Address: JP Tokyo
- Assignee: USHIO OPTO SEMICONDUCTORS, INC.
- Current Assignee: USHIO OPTO SEMICONDUCTORS, INC.
- Current Assignee Address: JP Tokyo
- Agency: Mattingly & Malur, PC
- Priority: JP2013-173112 20130823
- Main IPC: H01S5/22
- IPC: H01S5/22 ; H01S5/343 ; H01S5/34 ; H01S5/40 ; H01S5/022 ; H01S5/042 ; H01S5/10

Abstract:
Provided is a multi-beam semiconductor laser device in which deterioration of element characteristics is suppressed even when a beam pitch is reduced. The multi-beam semiconductor laser device includes: a first semiconductor multilayer in which a plurality of semiconductor layers are laminated; a plurality of light emitting ridge portions that are formed on the first semiconductor multilayer; a support electrode portion formed in a region between a pair of neighboring light emitting ridge portions; and a front ridge portion formed on the front side of the support electrode portion. The support electrode portion is electrically connected to one of the pair of neighboring light emitting ridge portions. The support electrode portion is higher than the one light emitting ridge portion. An end of the front ridge portion on the front end surface side is higher than the one light emitting ridge portion at the front end surface.
Public/Granted literature
- US20150055670A1 MULTI-BEAM SEMICONDUCTOR LASER DEVICE Public/Granted day:2015-02-26
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