Invention Grant
- Patent Title: Monolithically applied heating elements on saw substrate
- Patent Title (中): 在锯片上采用单片加热元件
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Application No.: US13065177Application Date: 2011-03-16
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Publication No.: US09232315B2Publication Date: 2016-01-05
- Inventor: Tom A. Martin , Pierre A. Dufilie , Joseph V. Adler
- Applicant: Tom A. Martin , Pierre A. Dufilie , Joseph V. Adler
- Applicant Address: US CT Simsbury
- Assignee: Phonon Corporation
- Current Assignee: Phonon Corporation
- Current Assignee Address: US CT Simsbury
- Agency: Alix, Yale & Ristas, LLP
- Main IPC: H05B1/00
- IPC: H05B1/00 ; H05B3/00 ; H05B11/00 ; H01L41/22 ; H04R17/00 ; G01M1/14 ; G01N29/00 ; G01V13/00 ; G01P15/08 ; G01P15/13

Abstract:
A surface acoustic wave (SAW) device comprising a piezoelectric substrate having a working surface with an active zone capable of propagating an acoustic wave on said working surface; at least one interdigital transducer on the working surface, having interdigital fingers aligned in the active zone for inducing or receiving surface acoustic waves in the active zone; and a heating element on the working surface; wherein the transducer, heating element and preferably a temperature sensor are monolithically formed on the substrate.
Public/Granted literature
- US20120234818A1 Monolithically applied heating elements on saw substrate Public/Granted day:2012-09-20
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