Invention Grant
- Patent Title: Method of making an inlay PCB with embedded coin
- Patent Title (中): 嵌入硬币的镶嵌PCB的方法
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Application No.: US13753422Application Date: 2013-01-29
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Publication No.: US09232630B1Publication Date: 2016-01-05
- Inventor: Henrik Jacobsson , Junlin Zhou
- Applicant: Flextronics AP, LLC
- Applicant Address: US CO Broomfield
- Assignee: Flextronics AP, LLC
- Current Assignee: Flextronics AP, LLC
- Current Assignee Address: US CO Broomfield
- Agency: Haverstock & Owens LLP
- Main IPC: H05K3/02
- IPC: H05K3/02 ; H05K3/10 ; H05K1/02 ; H05K3/00
Abstract:
A printed circuit board comprising: a plurality of dielectric core layers comprising at least a top dielectric core layer and a bottom dielectric core layer; a thermally-conductive coin embedded in at least one of the dielectric core layers; and a high frequency material inlaid in at least one of the dielectric core layers.
Information query
