A hyperfrequency interconnection device between two components is provided, each component comprising an upper face and a signal line arranged on the upper face, the planes containing the upper faces of the components being separated by a distance known as the height difference. The hyperfrequency interconnection device comprises a substrate comprising a lower face and an upper face defined by a first axis and a second axis perpendicular to the first axis, a signal line arranged on the lower face of the substrate, a projection of the signal line into the plane of the upper face forming the first axis, at least two contact pads capable of electrically connecting the signal line of the device to the signal line of the components. The upper face of the substrate is corrugated along the second axis, capable of conferring on the substrate flexibility along the first axis.