A knitted substrate (4; 16) for electrical connection of electronic components (3; 17a-f) thereto. The knitted substrate comprises a first set of substrate portions (5a-e; 9a-f) knitted with a first stitch pattern resulting in a first tensile stiffness; and a second set of substrate portions (6a-f; 18a-f) knitted with a second stitch pattern resulting in a second tensile stiffness that is greater than the first tensile stiffness. A substrate portion of the first set of substrate portions (5a-e; 19a-f) is provided between substrate portions (6a-f; 18a-f) of the second set of substrate portions, and each substrate portion of the second set of substrate portions (6a-f; 18a-f) comprises conductive yarns (11a-b) arranged to allow electrical connection of at least one of the electronic components (3; 17a-f) thereto.