Invention Grant
- Patent Title: Ceramic wiring board, multi-piece ceramic wiring board, and method for producing same
- Patent Title (中): 陶瓷接线板,多片陶瓷接线板及其制造方法
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Application No.: US14006047Application Date: 2012-02-01
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Publication No.: US09232643B2Publication Date: 2016-01-05
- Inventor: Masami Hasegawa , Satoshi Hirayama , Naoki Kito
- Applicant: Masami Hasegawa , Satoshi Hirayama , Naoki Kito
- Applicant Address: JP Nagoya
- Assignee: NGK SPARK PLUG CO., LTD.
- Current Assignee: NGK SPARK PLUG CO., LTD.
- Current Assignee Address: JP Nagoya
- Agency: Stites & Harbison, PLLC
- Agent Jeffrey A. Haeberlin
- Priority: JP2011-092556 20110419
- International Application: PCT/JP2012/000664 WO 20120201
- International Announcement: WO2012/144115 WO 20121026
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/03 ; H05K3/10 ; H05K1/02 ; H05K3/00 ; H05K3/46 ; H05K3/40

Abstract:
Provided are a ceramic wiring substrate; a multi-piece ceramic wiring substrate array for providing a plurality of the wiring substrates; and a method for reliably producing the wiring substrate array. The ceramic wiring substrate includes a substrate main body, which has a front surface, a back surface, side surfaces, a groove surface located on a side toward the front surface, and a fracture surface located on a side toward the back surface; and a notch which has a concave shape in plan view, and which is provided on at least one of the side surfaces so as to extend between the front surface and the back surface, wherein, in the side surface having the notch, the boundary between the groove surface and the fracture surface has curved portions on opposite sides of the notch, the curved portions being convex toward the front surface of the substrate main body in side view.
Public/Granted literature
- US20140034372A1 CERAMIC WIRING BOARD, MULTI-PIECE CERAMIC WIRING BOARD, AND METHOD FOR PRODUCING SAME Public/Granted day:2014-02-06
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