Invention Grant
- Patent Title: High speed differential wiring in glass ceramic MCMS
- Patent Title (中): 玻璃陶瓷MCMS中的高速差动接线
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Application No.: US14087341Application Date: 2013-11-22
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Publication No.: US09232645B2Publication Date: 2016-01-05
- Inventor: Jinwoo Choi , Daniel M. Dreps , Rohan U. Mandrekar
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Main IPC: H01L23/528
- IPC: H01L23/528 ; H05K1/02 ; C04B37/00 ; H05K1/03 ; H05K3/46 ; H01L21/48 ; H05K3/12 ; H01L23/522 ; H05K1/09 ; H01L23/13 ; H01L23/498 ; H05K3/00 ; H05K3/24

Abstract:
The embodiments of the present invention relate generally to the fabrication of integrated circuits, and more particularly to a structure and method for fabricating differential wiring patterns in multilayer glass-ceramic (MLC) modules. A structure and method of forming a MLC having layers with staggered, or offset, pairs of lines formed directly on one another are disclosed. In addition, a structure and method of forming a MLC having layers with staggered, or offset, pairs of lines that periodically reverse polarity are disclosed.
Public/Granted literature
- US20150144382A1 HIGH SPEED DIFFERENTIAL WIRING IN GLASS CERAMIC MCMS Public/Granted day:2015-05-28
Information query
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