Adhesiveless copper clad laminates obtained by metallizing excellent in wiring microfabrication ability in processing by semi-additive method, and a printed circuit board using the adhesiveless copper clad laminates excellent in wiring microfabrication ability as a base material are provided. The adhesiveless copper clad laminates include a base metal layer made of an alloy containing nickel and formed on at least one surface of an insulating film without using an adhesive in between, a thin copper layer formed on a front surface of the base metal layer by dry plating, and a copper plating film formed on a front surface of the thin copper layer by electroplating. The copper plating film contains 10 mass ppm to 150 mass ppm of sulfur in a depth range of at least 0.4 μm from the front surface of the copper plating film in a direction toward the insulating film.