Invention Grant
- Patent Title: Load reduced memory module
- Patent Title (中): 减少内存模块
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Application No.: US14687687Application Date: 2015-04-15
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Publication No.: US09232651B2Publication Date: 2016-01-05
- Inventor: Frederick A. Ware , Suresh Rajan
- Applicant: Rambus Inc.
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Lowenstein Sandler LLP
- Main IPC: H05K1/11
- IPC: H05K1/11 ; G11C11/4093 ; H05K1/18 ; G06F15/78 ; G11C11/408 ; G06F13/16 ; G06F13/40 ; G06F1/18 ; G11C5/04 ; G11C5/06 ; G11C7/10 ; H01R3/00 ; H03M9/00

Abstract:
The embodiments described herein describe technologies for memory systems. One implementation of a motherboard substrate includes first and second sets of data lines, the first set of data lines arranged into a first set of nibbles and the second set of data lines are arranged into a second set of nibbles with each of the first and the second sets of nibbles including a respective timing line for a respective timing signal. The motherboard substrate also includes a processor socket connected to the first set of data lines, a first slot connected to the processor socket via a first subset of the first set of nibbles, and a second slot connected to the processor socket via a second subset of the first set of nibbles and connected to the first slot via the second set of nibbles.
Public/Granted literature
- US20150223333A1 LOAD REDUCED MEMORY MODULE Public/Granted day:2015-08-06
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