Invention Grant
- Patent Title: Housing and method for making same
- Patent Title (中): 房屋及其制作方法
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Application No.: US14098685Application Date: 2013-12-06
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Publication No.: US09232659B2Publication Date: 2016-01-05
- Inventor: Chwan-Hwa Chiang , Chieh-Hsiang Wang
- Applicant: FIH (Hong Kong) Limited
- Applicant Address: HK Kowloon
- Assignee: FIH (Hong Kong) Limited
- Current Assignee: FIH (Hong Kong) Limited
- Current Assignee Address: HK Kowloon
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201310263976 20130628
- Main IPC: H05K3/00
- IPC: H05K3/00 ; H05K1/02 ; H05K1/16 ; H05K3/46 ; H04M1/02
Abstract:
A housing for an electronic device includes a ceramic base comprising ceramic material, at least one electronic element embedded in the ceramic base, and a buffer layer made of resin. The ceramic base includes an inner surface. The buffer layer is formed on the inner surface. A method for making the housing is also provided.
Public/Granted literature
- US20150003028A1 HOUSING AND METHOD FOR MAKING SAME Public/Granted day:2015-01-01
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