Invention Grant
- Patent Title: Compact ejectable component assemblies in electronic devices
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Application No.: US14058360Application Date: 2013-10-21
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Publication No.: US09232668B2Publication Date: 2016-01-05
- Inventor: Jason Sloey , Michelle Yu
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: APPLE INC.
- Current Assignee: APPLE INC.
- Current Assignee Address: US CA Cupertino
- Agency: Brownstein Hyatt Farber Schreck, LLP
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H01R13/62 ; H01R24/00 ; H05K5/02 ; H04B1/3816 ; G06K7/00

Abstract:
Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a base coupled to a circuit board for electrically coupling with the removable module, a cage for biasing the module down against the base, and a guide for retaining the module at a functional insertion position within the device.
Public/Granted literature
- US20140049920A1 COMPACT EJECTABLE COMPONENT ASSEMBLIES IN ELECTRONIC DEVICES Public/Granted day:2014-02-20
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