Invention Grant
- Patent Title: Flexible printed circuit integrated with conductive layer
- Patent Title (中): 柔性印刷电路集成导电层
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Application No.: US14113729Application Date: 2012-04-26
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Publication No.: US09237645B2Publication Date: 2016-01-12
- Inventor: Masayoshi Kido , Yoshihide Sekito
- Applicant: Masayoshi Kido , Yoshihide Sekito
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Kagan Binder, PLLC
- Priority: JP2011-102112 20110428
- International Application: PCT/JP2012/061262 WO 20120426
- International Announcement: WO2012/147870 WO 20121101
- Main IPC: H05K9/00
- IPC: H05K9/00 ; H05K1/02 ; H05K1/03
Abstract:
A conductive-layer-integrated flexible printed circuit board includes: (A) an electromagnetic-shielding conductive layer; (B) an insulator film; and (C) a wiring-pattern-equipped film the electromagnetic-shielding conductive layer (A), the insulator film (B), and the wiring-pattern-equipped film (C) being laminated in this order, the insulator film (B) containing at least (a) a binder polymer and (b) spherical organic beads.
Public/Granted literature
- US20140054081A1 NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER Public/Granted day:2014-02-27
Information query
