Invention Grant
- Patent Title: Wired circuit board and producing method thereof
- Patent Title (中): 有线电路板及其制造方法
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Application No.: US13485274Application Date: 2012-05-31
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Publication No.: US09241410B2Publication Date: 2016-01-19
- Inventor: Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
- Applicant: Saori Ishigaki , Jun Ishii , Yoshito Fujimura , Yuu Sugimoto
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils PLLC
- Agent Jean C. Edwards, Esq.
- Priority: JP2011-121280 20110531; JP2012-067717 20120323
- Main IPC: H05K1/16
- IPC: H05K1/16 ; H05K1/18 ; H05K3/32 ; G11B5/48
Abstract:
A wired circuit board includes an insulating layer, and a conductive layer including a wire covered with the insulating layer and a terminal continued to the wire to electrically connect the wire to an electronic element. The insulating layer is formed with an insulating opening exposing the terminal, and the terminal is formed in a pattern which is indented in a thickness direction.
Public/Granted literature
- US20130014976A1 WIRED CIRCUIT BOARD AND PRODUCING METHOD THEREOF Public/Granted day:2013-01-17
Information query
