Various embodiments of a capsule polishing device include a resistive-heating element including an electrically resistive, superelastic wire forming a loop between first and second ends of the superelastic wire. The first and second ends of the loop may at least partially extend from a planar face defined by the loop, to an insulating portion. In some embodiments, the capsule polishing device may be configured to perform active capsule polishing through a combination of hyperthermia of LECs and mechanical abrasion of the capsule surface. In some embodiments, at least a side and end portion of the loop of the capsule polishing device may be shaped to follow a contour of the capsule bag. The loop may be heated to approximately 40 to 47 degrees Celsius to destroy LECs (other temperatures are also possible). In some embodiments, the loop may include a roughened surface to increase mechanical abrasion.