Invention Grant
- Patent Title: Liquid processing apparatus and liquid processing method
- Patent Title (中): 液体处理装置和液体处理方法
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Application No.: US13478237Application Date: 2012-05-23
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Publication No.: US09242279B2Publication Date: 2016-01-26
- Inventor: Satoshi Kaneko
- Applicant: Satoshi Kaneko
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Abelman, Frayne & Schwab
- Priority: JP2011-116215 20110524; JP2011-116216 20110524; JP2011-116217 20110524
- Main IPC: B08B3/08
- IPC: B08B3/08 ; H01L21/67 ; B08B7/04 ; B08B5/00

Abstract:
Provided are a liquid processing apparatus and a liquid processing method that can optimize the state of air flow at an upper side of a substrate according to each liquid process performed during a substrate liquid processing. A liquid processing apparatus for performing a substrate liquid processing includes a support member configured to horizontally supporting the substrate; a gap forming member configured to form an annular gap between the gap forming member and an outer circumferential part of the support member; an upper liquid supplying member configured to supply a processing liquid to the substrate from an upper side; a cup configured to surround the annular gap and receive the processing liquid swept away from the rotating substrate through the annular gap; and an elevating mechanism configured to elevate the gap forming member.
Public/Granted literature
- US20120298147A1 LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD Public/Granted day:2012-11-29
Information query
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