Invention Grant
- Patent Title: Grinding wheel machining device
- Patent Title (中): 砂轮加工装置
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Application No.: US14191459Application Date: 2014-02-27
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Publication No.: US09242343B2Publication Date: 2016-01-26
- Inventor: Tai-Ping Shi , Qi-Cai Ke
- Applicant: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD. , HON HAI PRECISION INDUSTRY CO., LTD.
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.,HON HAI PRECISION INDUSTRY CO., LTD.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN2013100761807 20130311
- Main IPC: B24B53/12
- IPC: B24B53/12 ; B24B53/08

Abstract:
A grinding wheel machining device includes a movable platform and a grinding wheel machining mechanism. The grinding wheel machining mechanism includes a mounting assembly, a tool holder mounted on the movable member, a machining tool mounted on the tool holder, and an adjusting assembly. The mounting assembly includes a fixing base mounted on the movable platform, a movable member mounted onto the fixing base, and a rotation shaft received into the fixing base and the movable member. The machining tool includes a cutting edge. The adjusting assembly includes a reference member and an adjusting member. The reference member is fixed on the movable member and includes a reference surface. The reference surface is coplanar with a central axis of the rotation shaft. The adjusting member is received into the tool holder and threaded into the reference surface.
Public/Granted literature
- US20140251298A1 GRINDING WHEEL MACHINING DEVICE Public/Granted day:2014-09-11
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