Invention Grant
- Patent Title: Resin injection molding method and resin injection molded product
- Patent Title (中): 树脂注塑法和树脂注射成型品
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Application No.: US14408473Application Date: 2013-06-20
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Publication No.: US09242400B2Publication Date: 2016-01-26
- Inventor: Yoshikazu Fujita , Yoshiaki Imai , Etsuo Okahara
- Applicant: Kumi Kasei Co., Ltd. , UBE MACHINERY CORPORATION, LTD.
- Applicant Address: JP JP
- Assignee: Kumi Kasei Co., Ltd.,UBE MACHINERY CORPORATION, LTD.
- Current Assignee: Kumi Kasei Co., Ltd.,UBE MACHINERY CORPORATION, LTD.
- Current Assignee Address: JP JP
- Agency: Kolisch Hartwell, P.C.
- Priority: JP2012-141382 20120622
- International Application: PCT/JP2013/066946 WO 20130620
- International Announcement: WO2013/191241 WO 20131227
- Main IPC: B29C45/73
- IPC: B29C45/73 ; B29C45/00 ; C08L23/12 ; B29K23/00 ; B29K21/00 ; B29L31/00

Abstract:
A resin injection molding method of molding a resin by injection-filling an inside of a mold cavity formed by mold-clamping a pair of a design surface mold and a non-design surface mold, with a melted thermoplastic polypropylene resin composition, the method including: setting a temperature of each cavity-forming surface of the design surface mold and the non-design surface mold prior to the injection filling to 60° C. to 120° C., with the temperature of the cavity-forming surface of the design surface mold being 5° C. to 50° C. higher than the temperature of the cavity-forming surface of the non-design surface mold; and causing the resin pressure to reach a negative pressure within 7 seconds after injection filling is complete, wherein the thermoplastic polypropylene resin composition contains a crystalline polypropylene resin and a rubber component and a content of the rubber component is 1 mass % to 40 mass %.
Public/Granted literature
- US20150190953A1 RESIN INJECTION MOLDING METHOD AND RESIN INJECTION MOLDED PRODUCT Public/Granted day:2015-07-09
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