Invention Grant
- Patent Title: Composite plate structure and manufacturing method thereof
- Patent Title (中): 复合板结构及其制造方法
-
Application No.: US13654431Application Date: 2012-10-18
-
Publication No.: US09242426B2Publication Date: 2016-01-26
- Inventor: Jung-Chin Wu , Po-An Lin , Han-Ching Huang , Chih-Wen Chiang , Yen-Ling Liu
- Applicant: Jung-Chin Wu , Po-An Lin , Han-Ching Huang , Chih-Wen Chiang , Yen-Ling Liu
- Applicant Address: TW Taipei
- Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee: COMPAL ELECTRONICS, INC.
- Current Assignee Address: TW Taipei
- Agency: Jianq Chyun IP Office
- Main IPC: B32B3/24
- IPC: B32B3/24 ; B32B3/30 ; H05K5/02 ; B32B3/26 ; B32B37/12 ; B32B5/14

Abstract:
A composite plate structure including a fiber composite sheet, a metal layer, and a resin layer is provided. The fiber composite sheet includes a first fiber layer, a core layer, and a second fiber layer. The core layer is disposed between the first fiber layer and the second fiber layer. The metal layer is disposed on the fiber composite sheet and has at least one opening. A portion of the second fiber layer is located in the opening. The resin layer is disposed on the metal layer. In addition, a manufacturing method of the composite plate structure is also provided.
Public/Granted literature
- US20130108830A1 COMPOSITE PLATE STRUCTURE AND MANUFACTURING METHOD THEREOF Public/Granted day:2013-05-02
Information query