Invention Grant
- Patent Title: Method for laminating flat support materials on substrates
- Patent Title (中): 将基板上的平面支撑材料层压的方法
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Application No.: US11909993Application Date: 2006-02-20
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Publication No.: US09242430B2Publication Date: 2016-01-26
- Inventor: Christian Terfloth , Felix Starck
- Applicant: Christian Terfloth , Felix Starck
- Applicant Address: DE Detmold
- Assignee: JOWAT AG
- Current Assignee: JOWAT AG
- Current Assignee Address: DE Detmold
- Agency: Brannon Sowers & Cracraft PC
- Agent Edward E. Sowers
- Priority: DE102005015340 20050401
- International Application: PCT/EP2006/001495 WO 20060220
- International Announcement: WO2006/102957 WO 20061005
- Main IPC: B32B37/12
- IPC: B32B37/12 ; B32B7/00 ; B32B7/12 ; B29C63/48 ; B32B15/08 ; B32B38/12 ; B32B38/14 ; B29C63/02 ; B32B37/18 ; B32B37/20 ; B32B38/00 ; B32B38/06

Abstract:
The invention relates to a method for permanently joining an essentially flat support material to a substrate, in particular for laminating a plastic film to a metal substrate, wherein the at least essentially flat support material and/or the substrate is/are initially impinged upon by a connecting agent, preferably, an adhesive and subsequently the support material and the substrate are brought together in such a manner that the support material is permanently connected to the substrate, in particular, the plastic film is laminated on the metal substrate, and optionally, measuring and/or shaping of the thus formed composite material is carried out.
Public/Granted literature
- US20090053463A1 METHOD FOR LAMINATING FLAT SUPPORT MATERIALS ON SUBSTRATES Public/Granted day:2009-02-26
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