Invention Grant
- Patent Title: HMPSA for debondable self-adhesive label
- Patent Title (中): HMPSA用于脱粘自粘标签
-
Application No.: US13105740Application Date: 2011-05-11
-
Publication No.: US09242437B2Publication Date: 2016-01-26
- Inventor: David Goubard , Nicolas Sajot
- Applicant: David Goubard , Nicolas Sajot
- Applicant Address: FR La Plaine Saint Denis
- Assignee: BOSTIK S.A.
- Current Assignee: BOSTIK S.A.
- Current Assignee Address: FR La Plaine Saint Denis
- Agency: Hunton & Williams LLP
- Priority: FR1002001 20100511
- Main IPC: C09J153/02
- IPC: C09J153/02 ; B32B27/08 ; B32B7/12 ; C09J7/02 ; C09J7/04 ; C08K5/00 ; C08K5/09 ; C08K5/3445 ; C08L77/06

Abstract:
A hot-melt pressure-sensitive adhesive (HMPSA) composition comprising (a) 25 to 50% of one or more styrene block copolymers SBS, SIS, SIBS, SEBS or SEPS; (b) 35 to 75% of one or more compatible tackifying resins that are liquid or have a softening temperature below 150° C.; and (c) 1 to 20% of one or more supramolecular polymers obtained by reaction between 1-(2-aminoethyl)-2-imidazolidone and a fatty acid composition comprising 51 to 100% of one or more dimers and/or trimers of fatty acids and 0 to 49% of one or more monomers of fatty acids. A multilayer system including the HMPSA, an adjacent printable support layer, made of paper or a polymer film, and a protective layer adjacent is also provided. The multilayer system may be used in a self-adhesive label.
Public/Granted literature
- US20110281045A1 HMPSA for debondable self-adhesive label Public/Granted day:2011-11-17
Information query
IPC分类: