Invention Grant
US09242442B2 Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
有权
半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
- Patent Title: Method of manufacturing translucent rigid substrate laminate and translucent rigid substrate bonding apparatus
- Patent Title (中): 半导体刚性基板层压板和半透明刚性基板接合装置的制造方法
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Application No.: US13574510Application Date: 2011-01-13
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Publication No.: US09242442B2Publication Date: 2016-01-26
- Inventor: Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
- Applicant: Hiroyuki Kurimura , Hayato Miyazaki , Gosuke Nakajima
- Applicant Address: JP Tokyo
- Assignee: DENKA COMPANY LIMITED
- Current Assignee: DENKA COMPANY LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Stein IP, LLC
- Priority: JP2010-011156 20100121; JP2010-011162 20100121
- International Application: PCT/JP2011/050464 WO 20110113
- International Announcement: WO2011/089964 WO 20110728
- Main IPC: B32B37/02
- IPC: B32B37/02 ; B32B37/12 ; B32B38/18 ; B32B43/00 ; B32B17/10 ; B32B38/00 ; B32B37/24 ; G02F1/13 ; G02F1/1333
Abstract:
Provided is a method of manufacturing a translucent rigid substrate laminate to improve a positional precision. Further, a translucent rigid substrate bonding apparatus contributing to improvement of the positional precision while increasing production efficiency of a plate-shaped product is provided. In the method of manufacturing the translucent rigid substrate laminate and the translucent rigid substrate bonding apparatus according to the present invention, when translucent rigid substrates are bonded in a predetermined positional relationship by interposing a photo-curable fixing agent therebetween, the entire fixing agent interposed and spreading between both translucent rigid substrates is cured everytime the translucent rigid substrates are bonded.
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