Invention Grant
- Patent Title: Liquid-discharge-head substrate, method of manufacturing the same, and liquid discharge head
- Patent Title (中): 排液头基板,其制造方法以及排液头
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Application No.: US12548581Application Date: 2009-08-27
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Publication No.: US09242460B2Publication Date: 2016-01-26
- Inventor: Koichi Omata , Yoshiyuki Imanaka , Takaaki Yamaguchi , Yuuji Tamaru
- Applicant: Koichi Omata , Yoshiyuki Imanaka , Takaaki Yamaguchi , Yuuji Tamaru
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon USA, Inc., IP Division
- Priority: JP2008-221494 20080829
- Main IPC: B41J2/05
- IPC: B41J2/05 ; B41J2/14 ; B41J2/045 ; B41J2/16

Abstract:
A method of manufacturing a liquid-discharge-head substrate is provided, which includes a plurality of elements for discharging liquid, and a heating member for heating the liquid-discharge-head substrate, the method including the steps of preparing a substrate having an insulating layer made of an insulating material provided on or above the substrate, providing a conductive layer made of a conductive material, and forming a conductive line being configured to supply current for driving the element and a part of a heating member by using the conductive layer.
Public/Granted literature
- US20100053278A1 LIQUID-DISCHARGE-HEAD SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND LIQUID DISCHARGE HEAD Public/Granted day:2010-03-04
Information query
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