Invention Grant
- Patent Title: Liquid ejecting apparatus and maintenance method
- Patent Title (中): 液体喷射装置及维护方法
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Application No.: US14533732Application Date: 2014-11-05
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Publication No.: US09242469B2Publication Date: 2016-01-26
- Inventor: Takuya Okina
- Applicant: SEIKO EPSON CORPORATION
- Applicant Address: JP Tokyo
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Tokyo
- Agency: Workman Nydegger
- Priority: JP2013-235376 20131113
- Main IPC: B41J2/165
- IPC: B41J2/165 ; B41J2/19

Abstract:
A liquid ejecting apparatus includes: a liquid ejecting section in which a nozzle capable of ejecting liquid is provided; a supply flow path that supplies the liquid to the nozzle; a pressurizing mechanism that discharges the liquid from the nozzle by pressurizing the liquid inside the supply flow path; and a pressure reducing mechanism that discharges the liquid from the nozzle by reducing a pressure of a space communicating with a side opposite to a side of the supply flow path of the nozzle. In a maintenance operation discharging the liquid from the nozzle by driving at least one of the pressurizing mechanism and the pressure reducing mechanism, the last discharging operation of the maintenance operation is performed by driving the pressurizing mechanism from a state where the negative pressure is caused to act on the inside of the nozzle by driving the pressure reducing mechanism.
Public/Granted literature
- US20150130872A1 LIQUID EJECTING APPARATUS AND MAINTENANCE METHOD Public/Granted day:2015-05-14
Information query
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