Invention Grant
- Patent Title: Process for producing resin composition for optical semiconductor
- Patent Title (中): 光半导体用树脂组合物的制造方法
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Application No.: US14138763Application Date: 2013-12-23
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Publication No.: US09243129B2Publication Date: 2016-01-26
- Inventor: Takamitsu Oota , Takahiro Uchida , Tomohiro Fukuda
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2012-285791 20121227; JP2013-241235 20131121
- Main IPC: C08K7/18
- IPC: C08K7/18 ; C08K3/22 ; C08K5/05 ; B29B7/00 ; C08J3/20 ; B29B7/40 ; B29B7/46 ; B29B7/74 ; B29B7/82

Abstract:
The present invention relates to a process for producing a resin composition for an optical semiconductor from a powdery material and a liquid material using a kneader having a first supply port and a secondary supply port disposed at a downstream side of the first supply port, the process including: a step of supplying the powdery material into the kneader from the first supply port and delivering the powdery material to a second supply port side by the kneader at a temperature at which the powdery material is not melted; a step of melting the powdery material by heating and simultaneously supplying the liquid material from the second supply port under a pressure higher than a pressure in the kneader to knead a melted product of the powdery material and the liquid material; and a step of further kneading a kneaded product thereof while cooling.
Public/Granted literature
- US20140187671A1 PROCESS FOR PRODUCING RESIN COMPOSITION FOR OPTICAL SEMICONDUCTOR Public/Granted day:2014-07-03
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