Invention Grant
- Patent Title: Curable composition
- Patent Title (中): 可固化组合物
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Application No.: US14606682Application Date: 2015-01-27
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Publication No.: US09243166B2Publication Date: 2016-01-26
- Inventor: Min Jin Ko , Jae Ho Jung , Bum Gyu Choi , Dae Ho Kang , Min Kyoun Kim , Byung Kyu Cho
- Applicant: LG CHEM, LTD.
- Applicant Address: KR Seoul
- Assignee: LG CHEM, LTD.
- Current Assignee: LG CHEM, LTD.
- Current Assignee Address: KR Seoul
- Agency: Rothwell, Figg, Ernst & Manbeck, P.C.
- Priority: KR10-2012-0082686 20120727; KR10-2013-0089715 20130729
- Main IPC: C08G77/04
- IPC: C08G77/04 ; C09D183/04 ; C08L83/04 ; H01L23/29 ; H01L33/56

Abstract:
Provided are a curable composition and its use. The curable composition has excellent processability, workability and adhesiveness, exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and adhesiveness after curing, has long-lasting durability and reliability even under harsh conditions, and does not cause whitening or surface stickiness. The curable composition can be used as an encapsulant or adhesive material for an optical semiconductor such as an LED.
Public/Granted literature
- US20150137171A1 CURABLE COMPOSITION Public/Granted day:2015-05-21
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