Invention Grant
- Patent Title: Polyamide compounds containing pitch carbon fiber
- Patent Title (中): 含有沥青碳纤维的聚酰胺化合物
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Application No.: US14232864Application Date: 2012-07-12
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Publication No.: US09243178B2Publication Date: 2016-01-26
- Inventor: Haiyan Chen , Ching Lee Joseph Lim , Lai Chang Fong
- Applicant: Haiyan Chen , Ching Lee Joseph Lim , Lai Chang Fong
- Applicant Address: US OH Avon Lake
- Assignee: PolyOne Corporation
- Current Assignee: PolyOne Corporation
- Current Assignee Address: US OH Avon Lake
- Agent John H. Hornickel; Maria M. Hoke
- International Application: PCT/US2012/046509 WO 20120712
- International Announcement: WO2013/012685 WO 20130124
- Main IPC: C09K5/14
- IPC: C09K5/14 ; C08K3/38 ; C08K5/5313 ; C08K7/06
Abstract:
A thermally conductive polyamide compound is disclosed. The compound comprises a polyamide matrix with pitch-based carbon fiber, boron nitride, and organophosphinate flame regardant dispersed in the matrix. The compound can be extruded or molded into a heat dissipating article.
Public/Granted literature
- US20140166925A1 POLYAMIDE COMPOUNDS CONTAINING PITCH CARBON FIBER Public/Granted day:2014-06-19
Information query
