Invention Grant
US09243339B2 Additives for producing copper electrodeposits having low oxygen content
有权
用于生产氧含量低的铜电沉积物的添加剂
- Patent Title: Additives for producing copper electrodeposits having low oxygen content
- Patent Title (中): 用于生产氧含量低的铜电沉积物的添加剂
-
Application No.: US13480887Application Date: 2012-05-25
-
Publication No.: US09243339B2Publication Date: 2016-01-26
- Inventor: Trevor Pearson
- Applicant: Trevor Pearson
- Agency: Carmody Torrance Sandak & Hennessey LLP
- Main IPC: C25D3/38
- IPC: C25D3/38 ; C25D3/40 ; C25D21/04 ; C25D1/04
Abstract:
A copper electroplating bath for producing copper electrodeposits is described. The copper electroplating bath comprises (a) a soluble copper salt, (b) an electrolyte comprising one or more acids, and (c) a grain refining additive comprising an alkyl, aryl or alkylaryl diamine. The copper electroplating bath can be used for producing electroformed copper deposits having low oxygen content.
Public/Granted literature
- US20130313119A1 Additives for Producing Copper Electrodeposits Having Low Oxygen Content Public/Granted day:2013-11-28
Information query
