Invention Grant
- Patent Title: Method and device for manufacturing a sheet-like substrate
- Patent Title (中): 用于制造片状基材的方法和装置
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Application No.: US14350121Application Date: 2012-10-04
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Publication No.: US09243366B2Publication Date: 2016-01-26
- Inventor: Andreas Pretsch , Bernhard Wiedner , Manfred Heim , Michael Dornfeld , Johannes Kemper , Johannes Beier
- Applicant: GIESECKE & DEVRIENT GMBH
- Applicant Address: DE Munich
- Assignee: GIESECKE & DEVRIENT GMBH
- Current Assignee: GIESECKE & DEVRIENT GMBH
- Current Assignee Address: DE Munich
- Agency: Workman Nydegger
- Priority: DE102011115133 20111007
- International Application: PCT/EP2012/004155 WO 20121004
- International Announcement: WO2013/050150 WO 20130411
- Main IPC: D21H21/48
- IPC: D21H21/48 ; B42D25/355 ; D21H21/42 ; B42D15/00

Abstract:
A method includes manufacturing a sheet-type substrate having a security thread in which a security thread having features spaced apart from one another in the longitudinal direction of the security thread is inserted into the substrate in such a way that it is at least partially embedded in the substrate. At least one of the features is displayed as an image after the embedding of the security thread. The stretch of the embedded security thread in the longitudinal direction is calculated based on the image of the at least one feature, and the region of the substrate in which the calculated stretch of the security thread exceeds a specified maximum stretch is obliterated depending on the calculated stretch.
Public/Granted literature
- US20140332174A1 Method and Device for Manufacturing a Sheet-Like Substrate Public/Granted day:2014-11-13
Information query
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