Invention Grant
- Patent Title: Cooling system for high density heat load
- Patent Title (中): 用于高密度热负荷的冷却系统
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Application No.: US13601481Application Date: 2012-08-31
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Publication No.: US09243822B2Publication Date: 2016-01-26
- Inventor: Steven A. Borror , Franklin E. Dipaolo , Thomas E. Harvey , Steven M. Madara , Reasey J. Mam , Stephen C. Sillato
- Applicant: Steven A. Borror , Franklin E. Dipaolo , Thomas E. Harvey , Steven M. Madara , Reasey J. Mam , Stephen C. Sillato
- Applicant Address: US OH Columbus
- Assignee: Liebert Corporation
- Current Assignee: Liebert Corporation
- Current Assignee Address: US OH Columbus
- Agency: Locke Lord LLP
- Main IPC: F25D21/00
- IPC: F25D21/00 ; F25B23/00 ; F25B25/00 ; F25B7/00

Abstract:
A cooling system for transferring heat from a heat load to an environment has a volatile working fluid. The cooling system includes first and second cooling cycles that are thermally connected to the first cooling cycle. The first cooling cycle is not a vapor compression cycle and includes a pump, an air-to-fluid heat exchanger, and a fluid-to-fluid heat exchanger. The second cooling cycle can include a chilled water system for transferring heat from the fluid-to-fluid heat exchanger to the environment. Alternatively, the second cooling cycle can include a vapor compression system for transferring heat from the fluid-to-fluid heat exchanger to the environment.
Public/Granted literature
- US20120324930A1 COOLING SYSTEM FOR HIGH DENSITY HEAT LOAD Public/Granted day:2012-12-27
Information query
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