Invention Grant
- Patent Title: Nanopore device wetting
- Patent Title (中): 纳米孔器件润湿
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Application No.: US13951109Application Date: 2013-07-25
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Publication No.: US09244039B2Publication Date: 2016-01-26
- Inventor: Venkat K. Balagurusamy
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: G01N27/447
- IPC: G01N27/447 ; G01N33/487 ; B82Y30/00

Abstract:
A method for wetting a nanopore device includes filling a first cavity of the nanopore device with a first buffer solution having a first potential hydrogen (pH) value, filling a second cavity of the nanopore device with a second buffer solution having a second pH value, wherein the nanopore device includes a transistor portion having a first surface, an opposing second surface, and an orifice communicative with the first surface and the second surface, the first surface partially defining the first cavity, the second surface partially defining the second cavity, applying a voltage in the nanopore device, and measuring a current in the nanopore device, the current having a current path partially defined by the first cavity, the second cavity, and the orifice.
Public/Granted literature
- US20130334046A1 NANOPORE DEVICE WETTING Public/Granted day:2013-12-19
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