Invention Grant
US09244344B2 Actinic ray-sensitive or radiation-sensitive resin composition, and, resist film, pattern forming method, electronic device manufacturing method, and electronic device, each using the same
有权
光敏性或辐射敏感性树脂组合物，抗蚀剂膜，图案形成方法，电子器件制造方法和电子器件，各自使用它们
- Patent Title: Actinic ray-sensitive or radiation-sensitive resin composition, and, resist film, pattern forming method, electronic device manufacturing method, and electronic device, each using the same
- Patent Title (中): 光敏性或辐射敏感性树脂组合物，抗蚀剂膜，图案形成方法，电子器件制造方法和电子器件，各自使用它们
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Application No.: US13614872Application Date: 2012-09-13
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Publication No.: US09244344B2Publication Date: 2016-01-26
- Inventor: Kosuke Koshijima , Hidenori Takahashi , Shuhei Yamaguchi , Kei Yamamoto
- Applicant: Kosuke Koshijima , Hidenori Takahashi , Shuhei Yamaguchi , Kei Yamamoto
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-207021 20110922
- Main IPC: G03F7/038
- IPC: G03F7/038 ; G03F7/004 ; G03F7/039 ; G03F7/11 ; G03F7/20 ; G03F7/32
Abstract:
An actinic ray-sensitive or radiation-sensitive resin composition of the present invention includes a resin (P) having a repeating unit (a) represented by following General Formula (I), a compound (B) generating organic acid by irradiation of actinic ray or radiation, and 1% by mass or more of a resin (C) which has at least one of a fluorine atom and a silicon atom and is different from the resin (P) with regard to total solids of the actinic ray-sensitive or radiation-sensitive resin composition, wherein, in General Formula (I), R0 represents a hydrogen atom or a methyl group, and each of R1, R2, and R3 independently represents a straight chain or branched alkyl group.
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