Invention Grant
US09245555B2 Low resistance ground joints for dual stage actuation disk drive suspensions
有权
用于双级驱动磁盘驱动器悬架的低电阻接地
- Patent Title: Low resistance ground joints for dual stage actuation disk drive suspensions
- Patent Title (中): 用于双级驱动磁盘驱动器悬架的低电阻接地
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Application No.: US14531571Application Date: 2014-11-03
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Publication No.: US09245555B2Publication Date: 2016-01-26
- Inventor: Jeffry S. Bennin , Jacob D. Bjorstrom , Shawn P. Bopp , Reed T. Hentges , Michael T. Hofflander , Richard R. Jenneke , Craig A. Leabch , Mark S. Lewandowski , Zachary A. Pokornowski , Brian D. Schafer , Brian J. Stepien , John A. Theget , John E. Theisen , John L. Wagner
- Applicant: Hutchinson Technology Incorporated
- Applicant Address: US MN Hutchinson
- Assignee: Hutchinson Technology Incorporated
- Current Assignee: Hutchinson Technology Incorporated
- Current Assignee Address: US MN Hutchinson
- Agency: Faegre Baker Daniels LLP
- Main IPC: G11B21/16
- IPC: G11B21/16 ; G11B5/48
Abstract:
Stable, low resistance conductive adhesive ground connections between motor contacts and a gold-plated contact area on a stainless steel component of a dual stage actuated suspension. The stainless steel component can be a baseplate, load beam, hinge, motor plate, add-on feature or flexure.
Public/Granted literature
- US20150055255A1 LOW RESISTANCE GROUND JOINTS FOR DUAL STAGE ACTUATION DISK DRIVE SUSPENSIONS Public/Granted day:2015-02-26
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