Invention Grant
- Patent Title: Conductive metal ink
- Patent Title (中): 导电金属墨水
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Application No.: US13463927Application Date: 2012-05-04
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Publication No.: US09245664B2Publication Date: 2016-01-26
- Inventor: Daniel Kirk , Dave Hui , Martin Sweet
- Applicant: Daniel Kirk , Dave Hui , Martin Sweet
- Applicant Address: US DE Wilmington
- Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee: E I DU PONT DE NEMOURS AND COMPANY
- Current Assignee Address: US DE Wilmington
- Main IPC: H01B1/22
- IPC: H01B1/22 ; B05D5/12 ; C09D5/24 ; C09D11/52 ; H05K1/09 ; C08K3/08 ; C09D11/037 ; H05K3/12
Abstract:
A conductive metal composition comprising 50 to 94 wt % of silver particles having an average particle size in the range of 40 to 450 nm and having an aspect ratio of 3 to 1:1, 1 to 4 wt % of a thermoplastic polyester resin having a weight-average molar mass of 10000 to 150000, and 4 to 49 wt % of a diluent for the thermoplastic polyester resin.
Public/Granted literature
- US20130142963A1 CONDUCTIVE METAL INK Public/Granted day:2013-06-06
Information query
