Invention Grant
- Patent Title: Chip resistor and method of producing same
- Patent Title (中): 芯片电阻及其制造方法
-
Application No.: US13960749Application Date: 2013-08-06
-
Publication No.: US09245672B2Publication Date: 2016-01-26
- Inventor: Takashi Ohbayashi , Seigo Shiraishi , Kazunori Sakai
- Applicant: PANASONIC CORPORATION
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: McDermott Will & Emery LLP
- Priority: JP2011-038062 20110224
- Main IPC: H01C1/012
- IPC: H01C1/012 ; H01C1/14 ; H01C7/00 ; H01C17/00 ; H01C17/28 ; H01C1/028

Abstract:
An object of the disclosure is to provide a chip resistor without causing the disconnection in atmosphere of sulfidizing gas and without precipitating silver sulfide on its surface. The chip resistor of the present disclosure includes a resistor layer disposed on a top surface of a substrate; a first upper electrode layer disposed at both sides of the resistor layer and being electrically connected to the resistor layer; and a second upper electrode layer disposed on the first upper electrode layer and including between 75% by weight and 85% by weight (inclusive) of silver particles with an average particle diameter ranging from 0.3 um to 2 um, between 1% by weight and 10% by weight (inclusive) of carbon, and a resin.
Public/Granted literature
- US20130321121A1 CHIP RESISTOR AND METHOD OF PRODUCING SAME Public/Granted day:2013-12-05
Information query