Invention Grant
US09245812B2 Die with separate functional input, test out, enable input buffers
有权
具有单独的功能输入，测试输出，使能输入缓冲器
- Patent Title: Die with separate functional input, test out, enable input buffers
- Patent Title (中): 具有单独的功能输入，测试输出，使能输入缓冲器
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Application No.: US14570425Application Date: 2014-12-15
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Publication No.: US09245812B2Publication Date: 2016-01-26
- Inventor: Lee D. Whetsel , Richard L. Antley
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Lawrence J. Bassuk; Frank D. Cimino
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/66
Abstract:
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die. The added test pads allow a tester to probe and test more circuits within the die simultaneously. Also, the added test pads contribute to a reduction in the amount of test wiring overhead traditionally required to access and test circuits within a die, thus reducing die size.
Public/Granted literature
- US20150097186A1 DIE TESTING USING TOP SURFACE TEST PADS Public/Granted day:2015-04-09
Information query
IPC分类:
