Invention Grant
US09245823B2 Imaging device, imaging apparatus, production apparatus and method, and semiconductor device
有权
成像装置，成像装置，制造装置和方法以及半导体装置
- Patent Title: Imaging device, imaging apparatus, production apparatus and method, and semiconductor device
- Patent Title (中): 成像装置，成像装置，制造装置和方法以及半导体装置
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Application No.: US14212300Application Date: 2014-03-14
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Publication No.: US09245823B2Publication Date: 2016-01-26
- Inventor: Shunsuke Ishii , Satoshi Keino , Tomohiro Wada
- Applicant: Sony Corporation
- Applicant Address: JP Tokyo
- Assignee: SONY CORPORATION
- Current Assignee: SONY CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Hazuki International, LLC
- Priority: JP2013-065327 20130327
- Main IPC: H01L31/02
- IPC: H01L31/02 ; H01L23/48 ; H01L27/146
Abstract:
There is provided an imaging device including a semiconductor having a light-receiving portion that performs photoelectric conversion of incident light, electrically conductive wirings, and a contact group including contacts that have different sizes and connect the semiconductor and the electrically conductive wirings.
Public/Granted literature
- US20140291796A1 IMAGING DEVICE, IMAGING APPARATUS, PRODUCTION APPARATUS AND METHOD, AND SEMICONDUCTOR DEVICE Public/Granted day:2014-10-02
Information query
IPC分类:
